Features
- 1.Camera image eases BGA and PCB Pads alignment.
- 2.Auto BGA removal and soldering.
- 3.8stages are programmable to achieve optimal profile.
- 4.Real time profile is visible and adjustable.
- 5.Independent heating modules(top & bottom ),PID algorithm and close-loop control make temperature more even and accurate.
- 6.CE Certificated.
Product Applied
