| Product | Description | Color | Viscosity(MPa.S/25℃) | Curing | Curing Condition |
| EP3101L | Low temprature cure epoxy | Black | 7500 | Heat cure | 5-10mins@80℃ |
| Cure at 60℃ | |||||
| For temprture sensitive applications | |||||
| Low stress, Low shrinkage | |||||
| EP3106 | Low temprature cure epoxy | Black | 23,000@5rpm 8,700@50rpm | Heat cure | 30mins@80℃ |
| For temprture sensitive applications | |||||
| Good adhesion strength,high toughess | |||||
| Low stress , Low shrinkage | |||||
| EP3101 | Low temprature cure epoxy | Black | 100,000@5rpm 21,000@50rpm | Heat cure | 30mins@80℃ or 60mins@60℃ |
| Cure at 60℃ | |||||
| For temprture sensitive applications | |||||
| Low stress, Low shrinkage | |||||
| EP3111 | Low stress, no moire impact | Black | 4722 | Heat cure | 30mins@110℃ |
| Good 85℃/85% reliability performance | |||||
| Controlled flowability, applied for IC encapsulant | |||||
| EP3407B | Halogen Free, Applied for gold wire encapsulant | Black | 34800 | Heat cure | 60mins@110℃ |
| Low stress, no moire effect | |||||
| Good 85℃/85% reliability performance | |||||
| Controlled flowability | |||||
| Good adhesion with broad material | |||||
| UV3032 | UV fast cure | Transparent | 4874 | UV cure | ＞1,000mJ/cm² |
| No Moire effect with high /low temperature | |||||
| High transmittance >92%, applied for TFT sensor attach with glass. | |||||
| UV5106HV | Low permeability | Translucent | 4000 | UV cure | ＞1,500mJ/cm² |
| High elongation > 300% | |||||
| Controlled flowability, the height can be controlled less than 0.3mm | |||||
| Good toughness, and drop test performance | |||||
| UV3026 | Black UV adhesive glue | Black | 15391 | UV cure | > 10J/cm² |
| High Ti, High aspect ratio | |||||
| Low shrinkage | |||||
| Good adhesion on most substrates | |||||
| EC3601 | Electrically conductive | Silver | 11000 | Heat cure | 60mins@80℃ or 10mins@120℃ |
| Low temperature cure | |||||
| Good adhesion |
