| Parts | Application | Product | Description | Critical Properties | Curing Condition |
| PCB conform coating | Other parts assembly | UV5103/LG | – Single part | – Dielectric Strength@1MHz: 2.75 | ＞3,000mJ/cm² + 7days moisture cure |
| – UV + moisture cure | – Dissipation Factor@1MHz: 0.12 | ||||
| – Solvent free | – Dielectric strength: 50KV/mm | ||||
| – Good moisture resistance | |||||
| – Excellent chemical and electrical performance | |||||
| – Fluorescence contain | |||||
| – Comply with UL94V-0 | |||||
| MMA structural bonding | Other parts assembly | MA2010D | – Room temp fast cure | – Lap shear | 24 hrs @ 25°C |
| – Excellent adhesion, flexibility and high reliability with different substrates such as metal, glass, LCP and PA | PCGF vs Ni: 4.3MPa | ||||
| – High impact resistance | Al vs Al: 22MPa | ||||
| – Super peeling force | |||||
| Hi-performance epoxy | Battery assembly in new EV | XEP0546 | – Unique rheological property, high aspect ratio | – Tg: 110°C | 15 mins @ 150°C |
| – High Tg, Low CTE | – CTE1 / CTE2: 36 / 160ppm/°C | ||||
| – Good chemical resistance | |||||
| – High electrical strength | |||||
| – High reliability | |||||
| – Comply with UL94V-0 performance | |||||
| Silicone structural adhesive | Battery assembly in new EV | RTV19XX Series | – Single part, thermal conductive gel paste | – Working temp range: -50 to +200℃ | Thermal paste |
| – Thermal conductivity (0.4~6.0 W/m · K) | |||||
| – Ultra-low stress | |||||
| – Low oil separation | |||||
| – Long term stability and reliability | |||||
| – Auto-dispensing in line | |||||
| – Comply with UL94V-0 performance | |||||
| Dual-part thermal paste | Battery assembly in new EV | GF64XXD 800G | – Thermal conductivity-2.5 W/m·K | – Dielectric Strength≥10kv/mm | 30 mins @100°C |
| – Easy to dispensing in line | – Working temp range: -60~150°C | OR | |||
| – Room temperature or thermal fast cure | 15 hrs @25°C | ||||
| – Good electrical insulation, temperature and weather resistance | |||||
| – Low density (2.2g/cc), lower loading weight | |||||
| – Comply with UL 94 V-0 | |||||
| Dual-part thermal structural paste | Battery assembly in new EV | PU1600D Series | – Thermal conductivity (0.4~2.0w/m.K) | – Hardness: 60D~70D | Thermal cure or/and RT cure(refer to TDS) |
| – Room temp or thermal cure | – Good adhesion with Al and PET film | ||||
| – Good anti vibration and drop performance | |||||
| – Excellent sealing performance | |||||
| – Excellent reliability performance | |||||
| – Comply with UL 94 V-0 | |||||
| Lidar sensor assembly | ADAS assembly | EP3420 | – UV+thermal cure | – Tg >150°C | UV @ 365 nm > 3,000mj/cm2 |
| – High Tg, ultra-low CTE | – CTE1/CTE2: 18/70 ppm/℃ | AND | |||
| – Low shrinkage | – Die shear force@25°C | 130°C @ 30mins | |||
| – Excellent mechanical stability | Glass(3*3mm) vs Cu: 12kgf | ||||
| – Excellent reliability performance | |||||
| Camera assembly | ADAS assembly | EP3110/B | – Low modulus | – Lap shear@25℃ | 30mins @ 80ºC |
| – Good flexibility | Al vs Al: 7.5MPa | OR 20mins @100ºC | |||
| – Low temperature cure | LCP vs LCP: 5.0MPa | OR 10mins @120ºC | |||
| – Excellent adhesion with glass, metal, FR4 and LCP | |||||
| – Comply with UL94V-0 | |||||
| Chip bonding for OBC charging system | Power conversion in new EV | EC3603 | – Nano silver paste | – Thermal conductivity: 200W/m.K | 25°C to 200°C + 2hrs @ 200°C |
| – Excellent thermal conductivity | – Die shear force @ 260°C | ||||
| – High bonding strength with Au, Ag & Cu | 2 x 2 mm Si die on Ag: 31kgf | ||||
| – Good dispensing performance | 2 x 2 mm Si die on Cu: 30kgf | ||||
| Thermal conductive adhesive for DC/DC converter | Power conversion in new EV | GF6435RW | – Single part thermal paste | – Thermal conductivity: 3.5W/m.K | 60mins @80°C |
| – Low stress, low thermal resistance, high thermal conductivity | -Volume resistance: 1.0×10^14 | ||||
| – Auto-dispensing in line | |||||
| – Easy to rework | |||||
| Thermal conductive adhesive for DC/DC converter | Power conversion in new EV | GF64XXD Series | – Thermal conductivity(2.0~8.0W/m·K) | – Working temp range: -50~200°C | 30 mins @100°C |
| – Ultra low stress, low thermal resistance | OR | ||||
| – Auto-dispense in line | 24 hrs @25°C | ||||
| – Comply with UL94V-0 | |||||
| Hi-reliability underfill | Power conversion in new EV | UF3209 | – High Tg, Low CTE | – Tg: 150ºC | 8mins @ 150℃ |
| – High reliability performance | – CTE1 / CTE2: 45 / 150 ppm/℃ | ||||
| – Strong adhesion to metal and PC materials | |||||
| – Re-workable | |||||
| Hi-reliability underfill | Power conversion in new EV | UF3505 | – High Tg, Low CTE | – Tg: 160ºC | 5mins @ 150℃ |
| – Excellent reliability performance | – CTE1 / CTE2: 23 / 95 ppm/℃ | ||||
| ITO protection | Display | UV5106 | – Good liquidity and fast leveling | – Water Permeability @24 hrs,50ºC, 100% RH: 22 g/mil/100 in²/day | ＞1,500mJ/cm² |
| – UV fast curing | – Elongation: > 400% | ||||
| – Excellent moisture resistance | |||||
| – High flexibility | |||||
| – Easy to peel off | |||||
| LCD/OLED display bonding | Display | PUR1060B | – Room temperature moisture cure | – Lap Shear： | > 24 hrs@25℃ moisture cure |
| – Black, high shading ratio O. D>6 | AL6061 vs AL6061 @ 25℃ – 4.3MPa | ||||
| – High bonding strength to PC/PA | AL6061 vs AL6061 @ 75℃ – 1.4MPa | ||||
| FPC reinforcement | Display | UV3007F/UV3009F | – UV+moisture cure | – Hardness: 75D | ＞3,000mJ/cm² + 7days moisture cure |
| – Controllable flowability | – Dielectric constant @2MHz: 2.85 | ||||
| – Strong adhesion to various materials, such as PC, PLC, FR4, metal, etc | – Dissipation Factor @2MHz: 0.024 |
