发布于

Underfill-JoinTrust

Product Description Color CTE1/CTE2 Curing Condition Viscosity (MPa.S)
UF3210 Room temperature flow capability Black 68/197 10mins@130℃ 420
Easily reworkable
Good thermal shock & drop performance
High reliability
UF3211 Room temperature flow capability Black 56/170 ≥8mins@130℃ 400
Good drop test and 85/85 performance.
High reliability
UF3211M High Tg Black 52/177 ’10mins@130℃ 430
Room temperature flow capability
Excellent reliability
Reworkable
UF3209 High Tg Black 47/154 8 mins @ 150ºC 575
Excellent thermal cycle performance
Good adhesion to metal and plastic
Reworkable
UF3505 Excellent reliability Black 23/105 5mins@150℃ 8000
High Tg,Low CTE
发布于

Module Adhesives-JoinTrust

Product Description Color Viscosity(MPa.S/25℃) Curing Curing Condition
EP3101L Low temprature cure epoxy Black 7500 Heat cure 5-10mins@80℃
Cure at 60℃
For temprture sensitive applications
Low stress, Low shrinkage
EP3106 Low temprature cure epoxy Black 23,000@5rpm 8,700@50rpm Heat cure 30mins@80℃
For temprture sensitive applications
Good  adhesion strength,high toughess
Low stress  , Low shrinkage
EP3101 Low temprature cure epoxy Black 100,000@5rpm 21,000@50rpm Heat cure 30mins@80℃ or 60mins@60℃
Cure at 60℃
For temprture sensitive applications
Low stress, Low shrinkage
EP3111 Low stress, no moire impact Black 4722 Heat cure 30mins@110℃
Good 85℃/85% reliability performance
Controlled flowability, applied for IC encapsulant
EP3407B Halogen Free, Applied for gold wire encapsulant Black 34800 Heat cure 60mins@110℃
Low stress, no moire effect
Good 85℃/85% reliability performance
Controlled flowability
Good adhesion with broad material
UV3032 UV fast cure Transparent 4874 UV cure ＞1,000mJ/cm²
No Moire effect with high /low temperature
High transmittance >92%, applied for TFT sensor attach with glass.
UV5106HV Low permeability Translucent 4000 UV cure ＞1,500mJ/cm²
High elongation > 300%
Controlled flowability, the height can be controlled less than 0.3mm
Good toughness, and drop test performance
UV3026 Black UV adhesive glue Black 15391 UV cure > 10J/cm²
High Ti, High aspect ratio
Low shrinkage
Good adhesion on most substrates
EC3601 Electrically conductive Silver 11000 Heat cure 60mins@80℃ or 10mins@120℃
Low temperature cure
Good adhesion
发布于

Thermal conductive-JoinTrust

Product Description Thermal Conductive(W/M.K) Thermal Resistivity(℃­In²/W) Hardness(Shore OO) Viscosity(MPa.S/25℃)
TRM9103 Phase change thermal interface material 0.1 0.09 NA NA
Phase change at 47℃
Superior handling and rework ability
Excellent thermal reliability
GF6425D Tow parts thermal gel 2.5 NA 60 Paste
Low stress ,Low thermal  impedance , High thermal conductivity
Automatic dispensing
GF6440D Tow parts thermal gel 4 NA 32 Paste
Low stress ,Low thermal  impedance , High thermal conductivity
Automatic dispensing
GF6435L-3 ŸThermal gel (3.5 W/m·K) 3.5 0.06 < 15 Paste
Low stress, low thermal impedance
Automatic dispensing
UL94 V-0
GF6435RW Thermal gel 3.5 NA 70~80 Paste
Low stress ,Low thermal  impedance  High thermal conductivity
Automatic dispensing
Easy to rework
GF6440V 1:1 Dual-part thermal gel 4 NA 35 Paste
Low stress ,Low thermal  impedance , High thermal conductivity
Automatic dispensing
GF6460 Thermal gel 6 NA NA Paste
High thermal conductivity
发布于

Protection- JoinTrust

Product Description Color Curing Curing Condition Viscosity(MPa.S)
UV3007F UV/Mositure cure encapsulant Light blue translucent UV+Moisture cure ＞2,000mJ/cm² 23,890@0.3rpm 4,029@3rpm
High initial bonding strength
High Ti
UV3008F UV/Mositure cure encapsulant Blue UV+Moisture cure ＞2,000mJ/cm² 13,250@0.3rpm 2,100@3rpm
High initial bonding strength
UV3009F UV/Mositure cure encapsulant Light blue translucent UV+Moisture cure ＞2,000mJ/cm² 5,127@0.5rpm 1,156@5rpm
High initial bonding strength
Good flowability
UV5103HV1 UV+Moisture cure Transparent UV+Moisture cure ＞3,000mJ/cm² 420
Superior moisture and chemical resistance
Good wetting to various surfaces like solder masks, no-clean fluxes, metal coatings, etc..
UV5103L UV+Moisture cure conformal coating Light yellow UV+Moisture cure ＞2000mJ/cm² 500
Low viscosity
100% solid content
UV3010F UV/Mositure cure Milky White UV+Moisture cure 6,000mJ/cm² 20,000~30,000@6rpm
Low stree, low shrinkage, applied to the sensitive & critical component protection
Excellent reliability performance
UVH3035 UV+Heat cure Blue UV+Heat cure 2000mJ/cm² +10mins@130℃ 17,770@0.3rpm 5,572@3rpm
Low modulus
Good adhesive to metal and  plastics
Reworkable
UVH3036 UV+Heat cure Translucent UV+Heat cure 2000mJ/cm² +15mins@130℃ 10,000~20,000
Low shrinkage
Good adhesive to metal , plastics, glass ,and FR4 .
UV5106 Low energy  fast cure Light yellow UV cure ＞1500mJ/cm² 950
Good moisture resistance
High flexibility
UV3033H UV Fast cure Ivory White UV cure ＞1,500mJ/cm² 3,186@100rpm 5,568@10rpm
Non-flowable
Easy dispensability without stringing
Good adhesion on most substrates as PC, LCP, FR4, metal
UV3033 UV fast cure Ivory White UV cure ＞1,500mJ/cm² 4,350@100rpm 7,624@10rp
Non-flowable;
Good adhesion on most substrates as PC, LCP, FR4, metal
UV3028 UV fast-cure Light yellow translucent UV cure ＞1,500mJ/cm² 13,000@20rpm 37,700@2rpm
High Elongation, easy to peel off
Excellent chemistry solvent resistance
UV3046Y UV fast-cure Light yellow UV cure ＞1,500mJ/cm² 10,000@20rpm 21,700@2rp
High Elongation, easy to peel off
Excellent chemistry solvent resistance
UV3021 UV fast cure Amber Transparent UV cure ＞1,500mJ/cm² 16,000@20rpm 38,900@2rpm
High Elongation, easy to peel off
Excellent chemistry solvent resistance
UVH3036S Low shrinkage Light ivory Heat cure 20mins@160℃ 10,000~20,000

 

发布于

Structural bonding-JoinTrust

Product Description Color Operation Time(Mins) Viscosity(MPa.S/100℃) Bonding Strength(MPa)
PUR1058F Good adhesive to PC Pale white with fluorescence 3~5 2,500~4,500 PC – 12.3 PC(75oC) – 4.4 PA(55%GF) – 4.3 SUS – 4.3
Good sweat and detergent chemical resistance
Easy to rework
PUR1051 Long open time Creamy White 45052 4,000-5,000 PC – 8 PA – 6 SUS – 5.85 PBT- 5.6 AnAl – 4.6 PC (75℃) – 3.3
Good drop test performance > 300times@PC/Dupont test
Good adhesive & reliability test to PC/PA/SUS
PUR337 High initial adhesive force Creamy White 44928 6,000-7,000 PC – 4.4
Fast cure (1.7MPa@10min, PC vs PC)
PUR1059 Good adhesive to PC and the good performance in high temp(75℃) Amber ‘3-6 2,500~3,500 PC -11.1 PA(55%GF) – 7.2 SUS301 – 4.5 PC (75℃) – 3.7
Good adhesive to PC/PA/SUS
PUR340F/PUR340B Low viscosity Transparent with fluorescence/Black 3~5 2,000~4,000 PC -7.3 PA(55%GF) – 7.4 SUS – 3.5
Good adhesive to most
substrates such as PA /PC
Good thermal shock & drop performance
PUR1045F Good initial strength, fast cure Beige with fluorescence 44990 2,500~4,500 PC – 8.0 PA(55%GF) – 6.2 SUS – 5.1
Good adhesive to PC/PA/SUS
发布于

New EV Application – JoinTrust

Parts Application Product Description Critical Properties Curing Condition
PCB conform coating Other parts assembly UV5103/LG – Single part – Dielectric Strength@1MHz: 2.75 ＞3,000mJ/cm² + 7days moisture cure
– UV + moisture cure – Dissipation Factor@1MHz: 0.12
– Solvent free – Dielectric strength: 50KV/mm
– Good moisture resistance
– Excellent chemical and electrical performance
– Fluorescence contain
– Comply with UL94V-0
MMA structural bonding Other parts assembly MA2010D – Room temp fast cure – Lap shear 24 hrs @ 25°C
– Excellent adhesion, flexibility and high reliability with different substrates such as metal, glass, LCP and PA    PCGF vs Ni: 4.3MPa
– High impact resistance    Al vs Al: 22MPa
– Super peeling force
Hi-performance epoxy Battery assembly in new EV XEP0546 – Unique rheological property, high aspect ratio – Tg: 110°C 15 mins @ 150°C
– High Tg, Low CTE – CTE1 / CTE2: 36 / 160ppm/°C
– Good chemical resistance
– High electrical strength
– High reliability
– Comply with UL94V-0 performance
Silicone structural adhesive Battery assembly in new EV RTV19XX Series – Single part, thermal conductive gel paste – Working temp range: -50 to +200℃ Thermal paste
– Thermal conductivity (0.4~6.0 W/m · K)
– Ultra-low stress
– Low oil separation
– Long term stability and reliability
– Auto-dispensing in line
– Comply with UL94V-0 performance
Dual-part thermal paste Battery assembly in new EV GF64XXD 800G – Thermal conductivity-2.5 W/m·K – Dielectric Strength≥10kv/mm 30 mins @100°C
– Easy to dispensing in line – Working temp range: -60~150°C OR
– Room temperature or thermal fast cure 15 hrs @25°C
– Good electrical insulation, temperature and weather resistance
– Low density (2.2g/cc), lower loading weight
– Comply with UL 94 V-0
Dual-part thermal structural paste Battery assembly in new EV PU1600D Series – Thermal conductivity (0.4~2.0w/m.K) – Hardness: 60D~70D Thermal cure or/and RT cure(refer to TDS)
– Room temp or thermal cure – Good adhesion with Al and PET film
– Good anti vibration and drop performance
– Excellent sealing performance
– Excellent reliability performance
– Comply with UL 94 V-0
Lidar sensor assembly ADAS assembly EP3420 – UV+thermal cure – Tg >150°C UV @ 365 nm > 3,000mj/cm2
– High Tg, ultra-low CTE – CTE1/CTE2: 18/70 ppm/℃ AND
– Low shrinkage – Die shear force@25°C 130°C @ 30mins
– Excellent mechanical stability    Glass(3*3mm) vs Cu: 12kgf
– Excellent reliability performance
Camera assembly ADAS assembly EP3110/B – Low modulus – Lap shear@25℃ 30mins @ 80ºC
– Good flexibility     Al vs Al: 7.5MPa OR 20mins @100ºC
– Low temperature cure     LCP vs LCP: 5.0MPa OR 10mins @120ºC
– Excellent adhesion with glass, metal, FR4 and LCP
– Comply with UL94V-0
Chip bonding for OBC charging system Power conversion in new EV EC3603 – Nano silver paste – Thermal conductivity: 200W/m.K 25°C to 200°C + 2hrs @ 200°C
– Excellent thermal conductivity – Die shear force @ 260°C
– High bonding strength with Au, Ag & Cu    2 x 2 mm Si die on Ag: 31kgf
– Good dispensing performance    2 x 2 mm Si die on Cu: 30kgf
Thermal conductive adhesive for DC/DC converter Power conversion in new EV GF6435RW – Single part thermal paste – Thermal conductivity: 3.5W/m.K 60mins @80°C
– Low stress, low thermal resistance, high thermal conductivity -Volume resistance: 1.0×10^14
– Auto-dispensing in line
– Easy to rework
Thermal conductive adhesive for DC/DC converter Power conversion in new EV GF64XXD Series – Thermal conductivity(2.0~8.0W/m·K) – Working temp range: -50~200°C 30 mins @100°C
– Ultra low stress, low thermal resistance OR
– Auto-dispense in line  24 hrs @25°C
– Comply with UL94V-0
Hi-reliability underfill Power conversion in new EV UF3209 – High Tg, Low CTE – Tg: 150ºC 8mins @ 150℃
– High reliability performance – CTE1 / CTE2: 45 / 150 ppm/℃
– Strong adhesion to metal and PC materials
– Re-workable
Hi-reliability underfill Power conversion in new EV UF3505 – High Tg, Low CTE – Tg: 160ºC 5mins @ 150℃
– Excellent reliability performance – CTE1 / CTE2: 23 / 95 ppm/℃
ITO protection Display UV5106 – Good liquidity and fast leveling – Water Permeability @24 hrs,50ºC, 100% RH: 22 g/mil/100 in²/day ＞1,500mJ/cm²
– UV fast curing – Elongation: > 400%
– Excellent moisture resistance
– High flexibility
– Easy to peel off
LCD/OLED display bonding Display PUR1060B – Room temperature moisture cure – Lap Shear： > 24 hrs@25℃ moisture cure
– Black, high shading ratio O. D>6    AL6061 vs AL6061 @ 25℃ – 4.3MPa
– High bonding strength to PC/PA    AL6061 vs AL6061 @ 75℃ – 1.4MPa
FPC reinforcement Display UV3007F/UV3009F – UV+moisture cure – Hardness: 75D ＞3,000mJ/cm² + 7days moisture cure
– Controllable flowability – Dielectric constant @2MHz: 2.85
– Strong adhesion to various materials, such as PC, PLC, FR4, metal, etc – Dissipation Factor @2MHz: 0.024